Custom TFT-LCD

Custom TFT-LCD

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We are uniquely equipped to design and manufacture TFT-LCDs for highly bespoke specifications. Our team designs customized pixel patterns, resolutions, mask arrays, glass dimensions, polarizers, retarders, and TFT driving electronics.

  • Global Collaboration

    Our exclusive relationship with Kyocera Display in Japan allows for unprecedented collaboration of research and development, guaranteeing access to state-of-the-art TFT manufacturing at the Kyocera facility in Yasu, Japan. Using a Gen 3.5 manufacturing infrastructure, the product line is versatile in its ability to support both LTPS and aSi technologies.

  • Self-Monitoring Capabilities

    Custom display interface boards (DIBs) are available for bespoke TFT-LCD orders. This critical electronic component provides signals to the LCD glass integrated row and column drivers. Our DIBs include built-in-tests to report abnormal system functions on a high-reliability field-programmable gate arrays (FPGA) platform. These self-monitoring capabilities are essential in safety-critical applications and are a part of hardware design strategies to satisfy any RTCA DO-254 requirements.

  • Ultimate Efficiency

    Cevians manufacturing infrastructure is perfectly dimensioned for products of 20”x20” or smaller with low to high volume demand fulfillment capabilities. Our close collaboration and integrated engineering development practices result in the lowest minimal upfront tooling cost and minimum order requirements in the industry.

  • Highly Customized

    Cevians’ capabilities include designing aSi or low-temperature Poly Silicone in-plane switching technologies or TN. We also customize color filters to optimize the chromaticity of the final product for a given backlight spectral characteristic.

Technical Summary

    • Custom size: 4.8” to 28.1” diagonal
    • Custom glass finish, chamfer, radii, blackened edge
    • Custom color filter design, including Cevians patented VKK NVIS compatible chemistry
    • Chromaticity, 72%+ NTSC
    • Resolution, pixel density of 160ppi aSi and 445ppi for LTPS
    • In-plane switching (IPS) or TN technology with film compensation
    • Low reflection black mask, Cd free, RoHs and REACH compliant
    • Low specular reflection polarizer and black-masked conductors R<0.95%
    • Controlled diffusion front layers R<0.1%
    • Ruggedized, dense glass column spacer designs
    • Robust glass construction, 0.5mm or 0.7mm
    • High-temperature nematic fluids, T>105°C
    • Ruggedized mechanical assembly features, row and column driver chips, and flex connection
    • Custom pixel defect requirements
    • Signal redundancy
    • System design in accordance with design assurance up to level A in accordance with RTCA DO-254

Features

    • MIL-STD-810 for military ground and airborne applications, high vibration, and 50,000-foot high altitude
    • All standard and custom LCDs are available with bonded heater glass, AR coverglass, EMI glass, and NVIS backlighting
    • MIL-STD-704
    • MIL-STD-461
    • DO-160
    • BIT testing and reporting
    • Custom outline dimensions with chamfered corners
    • Oleophobic front surface
    • Low latency
    • High brightness >350 ftL
    • Low capability dimming down to 0.1 ftL
    • Sunlight readability to MIL-L-85762, high contrast >10:1
    • NVIS compliant to MIL-STD-3009
    • BlackBackground compliant
    • Minimal single point of failure with integrated redundancy
    • MTBF MIL-HBK-217F plus of 30,000 hours
    • Non-ITARS restricted

Custom TFT LCD glass

4.8"

Type
TN
Interface
TTL
Resolution
640x240
High temperature fluid
103°C
Active Area (mm)
115.2 x 43.2
Outline dimensions (mm)
122.7 x 51.3 mm
Viewing angle (H V °)
80, 80, 80, 60
Chip
COG
DIB (Display interface board)
ASIC TTL
Operating temperature (low temperature with a heater or slow response time)
-40°C to +85°C

5.7"

Type
TN
Interface
TTL
Resolution
640x480
High temperature fluid
103°C
Active Area (mm)
115.2 x 86.4
Outline dimensions (mm)
121.1 x 95.4 mm
Viewing angle (H V °)
80, 80, 80, 60
Chip
COG
DIB (Display interface board)
ASIC TTL
Operating temperature (low temperature with a heater or slow response time)
-40°C to +85°C

6.4" Monochrome

Type
TN
Interface
TTL
Resolution
640x480
High temperature fluid
103°C
Active Area (mm)
130.6 x 97.9
Outline dimensions (mm)
140.5 x 113.8 mm
Viewing angle (H V °)
80, 80, 80, 60
Chip
COG
DIB (Display interface board)
FPGA
Operating temperature (low temperature with a heater or slow response time)
-40°C to +85°C

6.4" TN

Type
TN
Interface
TTL
Resolution
640x480
High temperature fluid
103°C
Active Area (mm)
130.6 x 97.9
Outline dimensions (mm)
140.5 x 113.8 mm
Viewing angle (H V °)
80, 80, 80, 60
Chip
COG
DIB (Display interface board)
FPGA
Operating temperature (low temperature with a heater or slow response time)
-40°C to +85°C

6.4" IPS

Type
IPS
Interface
TTL
Resolution
640x480
High temperature fluid
103°C
Active Area (mm)
130.6 x 97.9
Outline dimensions (mm)
140.5 x 113.8 mm
Viewing angle (H V °)
85, 85, 85, 85
Chip
COG
DIB (Display interface board)
FPGA
Operating temperature (low temperature with a heater or slow response time)
-40°C to +85°C

2.3"x2.3" (3ATI)

Type
TN
Interface
TTL
Resolution
480x480
High temperature fluid
103°C
Active Area (mm)
57.6 x 57.6
Outline dimensions (mm)
77.8 x 77.8 mm
Viewing angle (H V °)
80, 80, 80, 60
Chip
COF
DIB (Display interface board)
ASIC
Operating temperature (low temperature with a heater or slow response time)
-40°C to +85°C

4"x4" (5ATI)

Type
IPS
Interface
LVDS
Resolution
480x480
High temperature fluid
103°C
Active Area (mm)
102.9 x 102.9
Outline dimensions (mm)
112.4 x 112.4 mm
Viewing angle (H V °)
85, 85, 85, 85
Chip
COG
DIB (Display interface board)
FPGA
Operating temperature (low temperature with a heater or slow response time)
-40°C to +85°C

5"x5"

Type
IPS
Interface
TTL
Resolution
600x600
High temperature fluid
103°C
Active Area (mm)
127.8 x 127.8
Outline dimensions (mm)
138.8x138.8 mm
Viewing angle (H V °)
85, 85, 85, 85
Chip
COG
DIB (Display interface board)
FPGA
Operating temperature (low temperature with a heater or slow response time)
-40°C to +85°C

6"x6"

Type
IPS
Interface
TTL
Resolution
780x780
High temperature fluid
103°C
Active Area (mm)
159.1 x 159.1
Outline dimensions (mm)
171.8 x 170.5 mm
Viewing angle (H V °)
85, 85, 85, 85
Chip
COG
DIB (Display interface board)
FPGA
Operating temperature (low temperature with a heater or slow response time)
-40°C to +85°C

10.4"

Type
IPS
Interface
LVDS
Resolution
1024x768
High temperature fluid
103°C
Active Area (mm)
210.4 x 157.8
Outline dimensions (mm)
221.5 x 172.2 mm
Viewing angle (H V °)
85, 85, 85, 85
Chip
COG
DIB (Display interface board)
FPGA
Operating temperature (low temperature with a heater or slow response time)
-40°C to +85°C

12.1"

Type
IPS
Interface
LVDS
Resolution
1280x800
High temperature fluid
103°C
Active Area (mm)
261.1 x 163.2
Outline dimensions (mm)
272.2 x 177.6 mm
Viewing angle (H V °)
85, 85, 85, 85
Chip
COG
DIB (Display interface board)
ASIC
Operating temperature (low temperature with a heater or slow response time)
-40°C to +85°C

20"x8"

Type
IPS
Interface
LVDS
Resolution
2560x1024
High temperature fluid
103°C
Active Area (mm)
508.4 x 203.4
Outline dimensions (mm)
522.4 x 221.1 mm
Viewing angle (H V °)
85, 85, 85, 85
Chip
COF
DIB (Display interface board)
FPGA quad channel LVDS
Operating temperature (low temperature with a heater or slow response time)
-40°C to +85°C

28" square

Type
IPS
Interface
LVDS
Resolution
2048x2048
High temperature fluid
103°C
Active Area (mm)
503.8 x 503.8
Outline dimensions (mm)
523.6 x 528.0 mm
Viewing angle (H V °)
85, 85, 85, 85
Chip
COF
DIB (Display interface board)
FPGA quad channel LVDS
Operating temperature (low temperature with a heater or slow response time)
-40°C to +85°C